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TECHNOLOGY FOR THE FUTURE

Micro Systems Lab. in AJOU UNIVERSITY

MEMS (MicroElectroMechanical Systems) is a class of systems that are physically small.
This system technologies are miniaturized systems which comprise sensor,actuators and electronic functions thereby opening up a whole range of new applications which would not be possible with purely microelectronic systems.
These systems have both electrical and mechanical components. Making small machines which are almost invisible has been one of the dreams of mankind. Such machines, so called MicroElectroMechanical Systems(MEMS) in US and micromachines in japan, are composed of both mechanical devices and electrical devices.

MEMS benefit
Small size / Lighter / Cheaper
Low Power / High reliability / Icrease levels of integration
Multifunctional enable / Cost effective

Korean Description

APPLICATIONS OF MEMS

Micro Systems Lab. in AJOU UNIVERSITY

Applications

Sensors and actuators are the two main categories of MEMS.
In recently a wide range of mems applications prototypes has been developed. MEMS are highly miniaturized devices that integrate a number of functions including fluidics, optics, mechanics, and electronics on a single silicon chip using traditional integrated circuit process technology. MEMS merge sensing, actuating, and computing into miniature systems that enable enhanced levels of perception, control, and performance. Example applications include advanced sensor technology used for airbag deployment for the automotive industry; optical switching devices developed for telecommunications; miniature drug delivery systems implemented by medical device companies; hand-held DNA analysis products for biotech companies; and HDTV quality projection displays on a chip developed by electronics component companies.

Military / MOEMS / BIO Medical / RF
SENSOR / ACTUATOR
ETC..

OUR LAB. FACILITIES

Micro Systems Lab. in AJOU UNIVERSITY

Facilities arrangement plan

Microfabrication Facilities

	Emulsion Mask Contact Aligner			Manufacturing company : Midas system Substrate Size : Piece~6inch Wafer Msk Size : 7inch X 7inch UV Lamp : 500W Dual Microscope Semi-auto System Type Beam Size : 6.25inch X 6.25inch 365nm Output Beam Intensity : 15-20mW/cm2 400nm Output Beam Intensity : 20-25mW/cm2
	Furnace for oxidation & diffusion			Manufacturing company : Sungjin semitech Wafer size : 4inch Operatin temperature : 25¡É~1100¡É Uniform Heat Zone - between : 400¡É~800¡É (200mm~250mm)±1¡É - between : 800¡É~1250¡É (250mm~300mm)±0.5¡É Use : oxidation, annealing, n/p doping
	Evaporator			Use : metal deposition
	PR Spin coater			Manufacturing company : Midas system 300rpm~8000rpm(3%) DC Motor Time : 1~999sec,variable Digital Program Type 50Step, 20Recipe Wafer size : Piece~6inch Wafer
	RIE (Reactive Ion Etching) System			Use : O2 plasma processing
	Electroplating Stations(Cu, Ni)			Use : metal electro plating
	Dicing Saw			Manufacturing company : Disco(Japan) Use : wafer sawing(Si, glass) Max workpiece Size : 250x 250 mm
	Sputter			Manufacturing company : Ultech Use : metal depositon Wafer size : 4inch Gun quantity : 3ea / 1-chamber(Ti, Au, Pt) RF power : 600W, 13.56MHz, Auto-matching type DC power : 2kW, Switching type

Analytical & Test Equipment

	Microscope			Manufacturing company : Olympus STAGE: Coaxial XY (Right Hand), 4in. x 4in. Travel OBJECTIVES: UM Plan FL 5X, UM Plan FL 10X, UM Plan FL 20X, UM Plan FL 50X
	Probe station			Manufacturing company : Ecopia Wafer size : 6inch Microscope : Olypus 120X Dimension : 575×485×430 mm(WDH) Manipulator traver : 10×10×10mm Screw resolution : 10§/pitch
	Depth profiler(Alpha step)			Manufacturing company : Tencor Ranges: 1000Å, 2500Å, 5000Å, 10kÅ, 25kÅ, 50kÅ, 100kÅ, 250k, 500kÅ and 1000kÅ. Leveling (Auto, Manual). Scan Length: 3mm (Manual mode), 2.5 mm (Automatic) Resolution: 50 Å