P R O C E S S I N G

 

 Batch MEMS-EDM (Electro-Discharge Machining)

Micro Systems Lab. in AJOU UNIVERSITY

JSR mold
These SEM pictures are the JSR (negative thick PR) molds for Cu electroplating.  The final goal of this research is the development of batch ECDM (electro chemical discharge machining) process for the packaging of micro gyro scope, cooperated with SAMSUNG Electric.  We can see the different shape of JSR structure depending on exposure energy.(Researcher: Ju Myoung Jung) 

 


Exposure energy: 12600 mJ


 Exposure energy: 14700 mJ


Exposure energy: 17850 mJ


Pole
Exposure energy: 12600 mJ 


Pole
Exposure energy: 14700 mJ


Pole
Exposure energy: 17850 mJ


Edge
Exposure energy: 12600 mJ


Edge
Exposure energy: 14700 mJ


Edge
Exposure energy: 17850 mJ

 

 
 

 KOREAN ABSTRACT

Micro Systems Lab. in AJOU UNIVERSITY

  

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